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New College Grad Mask Designer, Process Engineering

Job Description

The HDD Heads & Media Development Wafer Process Engineering team is looking for an entry level engineer to join our team and learn hands on as a Mask Designer for thin film heads. In this role you will support mask requirements for research, development and volume manufacturing. The Mask Designer will use 2-dimensional CAD to design photolithography masks for our leading edge head designs in Research and development as well as our continuous improvement projects in wafer manufacturing; and will work with design and process teams to produce high quality layouts per defined requirements and schedule. Ideal candidates will have recently earned or are pursuing a BS, MS, or PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering or a related field.

Responsibilities
  • Utilize 2D-CAD tools to design photolithography masks.
  • Understand semiconductor fabrication steps and how they relate to mask design
  • Initiate and lead design reviews with stakeholders
  • Create engineering drawings
  • Communicate with engineers to ensure all design requirements are documented and met
  • Create scripts to expedite and review designs
  • Maintain structured and organized file database
  • Manage and prioritize demands from multiple projects at once
  • Work with mask vendors to ensure mask specifications and schedules are understood and met
  • Document final mask design product that was submitted and received into wafer factory.


Qualifications

  • University students who graduated or are graduating from May 2020 to December 2021 with BS, MS or PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering or a related field
  • Creative, self-motivated, self-learner with superior teamwork skills
  • Active learning and/or hands-on project or research experience in semiconductor and nanotechnology fields
  • Developing technical skills and area of study towards, but not limited to, CAD, wafer process or thin film deposition processes
  • Exceptional written and verbal communication skills with the ability to work on the resolution of any issue and to interact with various interdepartmental engineering and support organizations
  • Demonstrated project driving skills, capable of managing projects with set milestones and timeline, and ability to execute with minimal supervision
  • Eligible Right to work in the US without requiring Western Digital to commence or sponsor an immigration case in order to employ you (for example, H-1B or other employment-based immigration case), preferred